IC Substrate Solutions

ff wire bond.jpgIC substrates are the critical interface between the semiconductor chip and the conductive component carrier they rest on.  Fabricators of these IC substrates require a capability to deliver an interconnect density far beyond that of the typical printed circuit board fabricator. To successfully build these complex designs requires a partner with proven specialty chemicals expertise in high density designs. 

MacDermid's Systek line of IC substrate chemistries represents the pinnacle of performance for the most technically challenging realm of printed circuit board processing. From metallization and imaging to circuit formation and surface finishing, MacDermid Electronics Solutions has the extensive fabrication experience you can trust. No other company has the breadth of chemistries, and no other company makes it easier to achieve higher productivity at lower total costs.

Our complete portfolio of Systek chemistries has been optimized for the challenges of IC substrate fabrication, and can be seamlessly integrated into your existing operations. Coupled with an unparalleled team of Applications Specialists, and our intimate understanding of the requirements of the industry's largest end-users, MacDermid is ideally suited to help you navigate through any unfamiliar or complex IC substrate issue. This enabling combination of innovative chemistry and superior technical service will assure your success in this highly competitive marketplace.  As an acknowledged worldwide leader in providing proven, innovative chemistries that satisfy both fabricator and OEM requirements, MacDermid is the company you can count on for all of your IC substrate chemistry needs.

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