MacDermid Enthone’s Affinity ENIG 2.0 is a highly stable, low corrosion electroless nickel / immersion gold process developed with the needs of OEMs and quality engineers in mind. The benefits of Affinity ENIG 2.0 come from its highly tightened process variation compared to competing processes. Low variation means savings due to reduced gold plating consumption.
Affinity ENIG 2.0 is the result of developments in leading ENIG technologies from our newly integrated companies combined with new innovations from our experienced plating staff experts.
In the decades that ENIG has existed as a high performance final finish alternative, it has been vulnerable to corrosion defects due to the nickel-gold replacement reaction. This is caused by non-uniform plating in the nickel and gold baths and wide variation in the chemical operation.
Traditional ENIG has uniformity and process variation issues, leading to highly concentrated corrosion defects and reliability problems.
Affinity ENIG 2.0 is highly uniform, creating a deposit with reduced corrosion and high uniformity.
Consistency is everything. Affinity ENIG 2.0 comes with one of the most advanced electroless nickel baths sold for electronics manufacturing. The temperature resistant stabilizer and dummy free operation allow for savings in operating costs. The highly uniform phosphorous content prevents catastrophic failures in reliability of soldered components.
The minimum specification called for by the IPC for ENIG gold thickness is 1.6 microinches. This means that a defect free process will be operated with a targeted mean plating thickness of 1.6 microinches plus four standard deviations to ensure that all parts coming out of the process are within. Anything less, and the line will begin to regularly produce scrap panels. Formulated to work together, the electroless nickel and immersion gold baths of Affinity ENIG 2.0 are able to produce a process with a standard deviation in gold thickness far below that of any competing system.
This means that once you make the switch to Affinity ENIG 2.0, every single panel produced from the line will require less gold consumption than before.
The difficulty of an electroless nickel / immersion gold process is in its complexity. The multiple pre-treatment steps, plating steps and process control levers to consider are the reason why ENIG has been a historically difficult process to handle. Affinity ENIG 2.0 was developed using process control methodology and the result is a more streamlined, capable, and easier to use final finish that meets all surface finishing requirements when operated as intended.