Vertical Electroplate

Blind Micro Via Fill

MacuSpec VF Series is a unique, production-proven process that is specifically engineered to be the most effective method to simultaneously plate through holes and fill blind microvias in one bath. Developed for fabricators and OEMs that require increased productivity and faster ROI, it eliminates an entire process sequence for greater application flexibility, while increasing overall bath life 400%.

stacked_substrate.jpgStacked via package substrate

Periodic Pulse Reverse (PPR)

For the highest performance, and special applications, MacDermid Enthone offers the MacuSpec PPR and MacuSpec PPR 100 for all types of pulse wave forms. Superior microdistribution, improved physical properties and decreased cycle time are the attributes to this industry leading product line.

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Hi Aspect Ratio Plating

Technical Publications

Through Hole Plating

INNOVATIVE HIGH THROW COPPER ELECTROPLATING PROCESS FOR METALLIZATION OF PCB
Maria Nikolova PhD and Jim Watkowski, MacDermid Enthone Waterbury, CT

Copper electroplating is widely used in the electronic industry for fabrication of electronic devices. It is particularly explored for fabrication of printed circuit boards and semiconductors. High throwing power copper electrolytes are becoming increasingly important due to the electronic industry requirements for manufacturing of high aspect ratio circuit boards. Click here to read more.

RELIABLE ACID COPPER PLATING FOR METALLIZATION OF PCB
Maria Nikolova, Jim Watkowski, Don DeSalvo, and Ron Blake, MacDermid Enthone Waterbury, CT

Copper plating is widely used in the electronic industry for fabrication of electronic devices. It is particularly explored for fabrication of printed circuit boards and semiconductors. Copper is electroplated over the surface of a printed circuit board and onto the walls of the through holes. The mass PCB production requires intensification of and at the same time simplifying the metallization process without scarifying and even further more improving the reliability. Various approaches have been studied in order to plate high aspect ratio (AR) through holes with improved micro-distribution and improved mechanical properties of the plated copper such as Tensile Strength and Elongation. Click here to read more.

Key Features