Hoist And Vertical Continuous Plating

Hoist and Vertical Continuous Plating

Vertical Continuous Plating Systems deliver high productivity through increased automation and increased plating current density while improving plating performance. Choosing the proper product for the equipment set is as important as choosing the equipment.

MacuSpec HT 360

MacuSpec HT 360 is an advanced, direct current acid copper system that offers excellent microdistribution under higher current densities. The MacuSpec HT 360 system is capable of plating copper with exceptional brightness, ductility and uniformity at a current density range of 20 to 30 ASF for through holes of up to 8:1 aspect ratio. The MacuSpec HT 360 bath is fully analyzable by CVS and common analytical tools, making it an excellent choice for bringing your plating operation under tighter statistical control while maintaining higher-than-ever production volumes. The deposit produced by MacuSpec HT 360 passes all specifications required for high volume multilayer board production including IPC 6012.DS Tensile and Elongation 2.4.18.1.

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A through hole plated with MacuSpec HT 360.

MacuSpec HT 300

MacuSpec HT 300 is the next generation ultra-performance direct current copper plating solution for plating higher technology multi-layer through holes. HT 300 maintains excellent microdistribution with industry leading performance at higher current densities for through holes with aspect ratio of up to 25:1. The MacuSpec HT 300 has an exceptionaly wide current density range of 5 to 25 ASF for plating high aspect ratio panels with a bright surface finish. MacuSpec HT 300 bath is fully analyzable by CVS and common analytical tools, making it the only choice for ensuring high yields and process stability while creating high tech multilayer printed circuit boards at breakneck speed. The deposit produced by MacuSpec HT 360 passes all specifications required for high volume multilayer board production including IPC 6012.DS Tensile and Elongation 2.4.18.1.

MacuSpec HT 200

MacuSpec HT 200 has been specifically formulated for providing higher microdistribution at higher current densities, which makes it an excellent product choice for continuous vertical platers. The MacuSpec HT 200 acid copper system deposits a bright, smooth, ductile copper deposit within a current density range of 5 to 30 ASF. The mechanical properties of the plated deposit exceed IPC specifications across the entire current density range and HT 200 is capable of plating through holes up to an aspect ratio of 10:1.

Key Features