Plating high aspect ratio through holes, conformal plated blind microvias and stacked filled vias for build up technology are just some of the challenges of the PWB manufacturing environment. The reliability of these constructions is only as good as the copper plating within them. Today’s requirements call for higher standards of mechanical properties, process control and flexibility. The product chosen must fit the end application.

MacDermid has a core competency in acid copper and has developed a full portfolio of acid copper products to meet all end user applications, from ultra aspect ratio conformal plating down to filling the smallest blind microvias.

Tin Plating

Augmenting our copper plating products, MacDermid offers electrolytic acid tin as an etch resist. MacDermid’s ResTin offers a uniform matte white, fine grained tin deposit that is used as an etch resist for ammoniacal etching. ResTin has a wide operating window for ease of operation, and low maintenance.

Technical Publications

Jim Watkowski and Tim Spencer, MacDermid Waterbury, CT

The need to minimize PWB real estate requiring smaller holes and increasing circuit density has driven the technology towards via in pad and stacked microvia designs. This high density interconnect technology – HDI - has become part of the printed circuit board lexicon. Attributes of this technology are increased processing speed, which improves device performance, miniaturization which enables more functionality in the same or less amount of space, and portability which allows all these highly functional devices to fit conveniently in a small handbag or shirt pocket. The majority of these devices are consumer electronics and like all consumer driven markets, downward price pressure is constant and severe. Fabricators must find new methods to produce HDI technology at lower and lower costs while maintaining high quality standard... Click here to read more.

Electroplate Processes