Direct Plating

The demand for lower costs and more environmentally friendly processes has generated a need for alternatives to conventional electroless copper processing. MacDermid responded with the patented Blackhole direct plate technology. The Blackhole direct plate technology eliminates heavy metals, formaldehyde and cyanide, while reducing operating costs. This horizontal process makes through holes and blind vias conductive utilizing a carbon black technology. This carbon black technology allows electrolytic copper to plate directly to the interconnects, yielding high copper to copper adhesion.

The Ultimate Choice for Mission-Critical PTH Reliability

rohs_compliant.jpgMacDermid Eclipse is the next generation direct metallization process, engineered specifically for fabricators and OEMs that require consistently high performance, reliability and durability. Simpler to use and considerably more cost-efficient than electroless copper, Eclipse provides high tech capabilities and RoHS-compliance all in one.

The new benchmark in PTH metallization, carbon-based Eclipse features 10:1 aspect ratio and higher PTH capability, achieves over 500 IST cycles, and enables manufacturers to decrease chemical usage and water consumption by 90%. The new environment standard reduces process steps by 50% and eliminates 100% of chelated metals. Utilizing an automated horizontal process, Eclipse delivers unmatched coverage and connectivity for even the most challenging designs, and is supported by MacDermid's renowned hands-on global technical service.

The Most Reliable PTH Metallization Process For The Lowest Cost Of Ownership


If you are looking for quantifiable reasons to switch from electroless copper to the industry's most environmentally-responsible and cost-efficient PTH metallization process, our revolutionary Eclipse formulation is your solution. Now you can dramatically reduce volatiles and waste pollutants, eliminate unwanted heavy metals and formaldehyde, and extend the life of your bath. All without sacrificing reliability and hole integrity, and at the lowest total cost. Guaranteed.

Direct metallization means that Eclipse allows copper plating directly onto the innerlayer, maximizing reliability with no interfering layers.


Versatile And Cost Efficient The Worlwide Choice For Direct Metallization

MacDermid Blackhole is the choice of fabricators worldwide that prefer a low cost, environmentally friendly direct metallization alternative to electroless copper. Suitable for both simple and complex circuit boards, carbon-based Blackhole is a nanoscale electrostatic coating that satisfies every need for reliability and versatility.

Trusted by over 250 of the world’s leading manufacturers, Blackhole is an automated, horizontal process whose unique technology enables users to reduce cycle time, decrease overall water consumption, completely eliminate the use of formaldehyde, and produce less waste than electroless copper plating. Another innovation from the leaders in metallization, Blackhole is also the world’s first totally chelator-free process. Able to provide high performance results in conventional, flexible and complex multilayer circuit board designs, MacDermid Blackhole is the most technically capable and cost effective option available today.

The Lowest Cost Through-Hole Metallization Process Available

PCB fabrication costs are the result of many factors: chemical consumption, waste production, engineering support, and process yield, among others. Blackhole provides a value in use which drops right to your bottom line.The world's most efficient direct metallization process minimizes costs associated with installation, operation and final product yield. Chemical consumption is an order of magnitude lower than electroless copper systems, reducing maintenance, analysis and replenishment time. Fewer, shorter process steps dramatically reduce the cycle time while minimizing rinsing and waste-treatment requirements.Its horizontal automation is equally well suited to high volume or quick-turn, prototype production.


Blackhole enables a uniform electrolytic coating and an intimate copper-to-copper bond for highest reliability interconnects.

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MacDermid's unrivaled experience with direct plate chemistry, equipment, and process control results in a trouble-free metallization solution.

Eclipse Key Features

 Blackhole Key Features

  • Lowest cost direct plate alternative to electroless copper
  • Direct copper-to-copper bonding improves reliability
  • No chelators, formaldehyde or added metals
  • Compatible with all circuit board types
  • Horizontal conveyorized process
  • Engineered for reliability and performance