Desmear And Metallization

Today's technical challenges of miniaturization, increased signal speed, advanced resin systems combined with higher reliability requirements place more emphasis on performance of all processes involved, and the foundation of success is reliable metallization.

From removing smear, to making through holes conductive, to plating the proper copper thickness in the holes as well as uniformity across the circuits, to filling blind microvias and plating a metallic etch resist, MacDermid has the right solution for the industry.

MacDermid's metallization technology group continues to research and develop new solutions to meet the ever changing manufacturing landscape ahead. Innovative solutions coupled with applications know how has made MacDermid an industry leader in the field.

Desmear And Metallization Processes