The UltraStrip product line represents MacDermid's most advanced, high-performance photoresist strippers. UltraStrip formulas have been optimized for over 50 different resists on the market today. UltraStripRS-215 Resist Stripping System is designed to strip fully-aqueous dry film photoresists from printed circuit boards. Its unique blend of components promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters, even under overplated circuits. RS-215 contains no caustic, so it will not attack copper, tin or tin-lead. It has a powerful anti-tarnish package to prevent copper oxidation. RS-215 does not contain glycol ethers or any other solvent.
The patented Eliminator C tin and tin/lead strippers provide manufacturing with the state-of-the-art results. Eliminator C is an efficient, economical tin and tin/lead stripper. It increases productivity while reducing frequent bath changeovers, downtime and labor costs. Eliminator C contains no peroxide, fluoride or chelators, and is formulated primarily for spray applications. Eliminator C is ideally suited for a steady-state, feed and bleed operation and will not sludge. A make-up or starter solution, Eliminator Make UpSolution is required to start the system the first time.
Developer 45 Plus and Develop 40 are highly concentrated aqueous photoresist developer solutions, making feed-and-bleed control of the developer solution simple and consistent.
MacDermid pioneered many of the key chemistries and process parameters of alkaline etch systems.
MacDermid's Etchant Innovations
Ultra Etch FL is a high speed, moderate capacity, continuous alkaline etchant system used in the manufacture of fine line printed circuit boards. It will remove copper at an etch rate of 2.0 -2.5 mils per minute at 125°F (52°C), and can dissolve and hold copper in solution in the range of 12 to 18 oz/gal (90 to 135 gm/L).
This ammoniacal etchant shows excellent undercut characteristics for the production of very fine line circuitry commonly found on high density inner and outer layers of multilayer boards (under 5 mil lines and spaces on 1 oz base laminate). Many types of resists can be used including gold, nickel, tin, tin-nickel and tin-lead. Due to this system's low pH capability (7.6-8.4), alkaline strippable inks and aqueous dry films have been used successfully.
Ultra Etch 20 is a high speed, moderate capacity ammoniacal copper etchant used in the manufacture of printed circuit boards. It etches at a rate of 2.5-3.0 mils/minute at 115-130F (46-54C) and has a copper capacity of 18-20 oz/gal(135-150 g/L). Its lower freezing point and excellent stability combine to make Ultra Etch 20 a trouble free solution.
Ultra Etch 50 is a high speed, high copper capacity alkaline etchant solution used in the manufacture of printed circuit boards. It will remove copper at an etch rate of 2.5-3.0 mils per minute at 130F (54C). It can dissolve and hold copper in solution in the range of 20-24 oz/gal. (150-180 g/L).
For over 20 years we have been the worldwide market leader in this technology, providing integrated chemistry/equipment systems, etchant recycling and accurate control systems