Specialty Processes - Formerly Electrochemicals

Specialty Processes


A hydrogen peroxide-sulfuric acid formulation designed to strip nickel and copper from aluminum, plastic and stainless steel. The process will also remove electroless nickel deposits from printed wiring boards while leaving the underlying copper in a virtually pristine state, thus allowing the printed board to be reprocessed through electroless nickel.


Our AQ Anti-foam is an efficient non-silicone based defoamer that is particularly used in dry film / ink stripping and photo-imageable solder mask developing.  Specifically formulated to resolve foam problem, its formulation is ideal for use in conveyorized spraying machines without adversely affecting the equipment.

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