Solar Clean 30A and Solar Clean 32A are acidic liquid materials which, when diluted with water, can be used to clean and activate copper prior to electroplating. Solar Clean 30A is designed as a no etch cleaner intended to clean vapor deposited copper with minimal attack on the thin metal seed layer. And it is designed for immersion cleaning applications. The 32A version is an acidic cleaner/etch for aluminum seed layers.
The Solar Etch HP and Solar Etch HPC are hydrogen peroxide/sulfuric acid microetchants that provide an efficient, stable cleaning and etching process for copper and thin film copper composites such as CIGS. It can be used in spray or immersion. Solar Etch HP is a self-contained system, that includes stabilizers, etch rate promoters and the hydrogen peroxide. The Solar Etch HPC is a concentrated version of the standard Solar Etch HP. With the HPC version, the operator adds hydrogen peroxide in conjunction with the concentrate.
The Solar Etch HP and Solar Etch HPC processes are used in precleaning and etching of solar substrates prior to the various plating and processing steps. The process may be used as a direct substitute for ammonium and sodium persulfates, thus eliminating the disposal problem associated with the frequent dumping of these spent solutions. Both formulations are environmentally sound and contain no chelators and can be operated in a closed loop system, allowing for the recovery of the etched copper as a salt.
Solar Plate Cu PV-71 Process is an outstanding copper sulfate plating system designed to produce a bright, ductile copper deposit particularly suited for the solar industry. Solar Plate Cu PV-71 is specially designed for with low internal stress for use with thin silicon wafers. Solar Plate Cu PV-71 Process is a two part additive system which produces improved leveling by the action of a separate grain refiner component, Solar Plate Cu PV-72.
Solar Plate Sn PV-24 Process is a matte acid tin process specifically designed for the plated etch resist of solar cell substrates. Solar Plate Sn PV-24 solutions have excellent throwing power and efficiency
Solar Strip CT90 is an acidic, ferric nitrate based stripper that will remove thin film metallic coatings such as tin, cadmium or telluride from solar wafers. It can be used to ensure a clean surface for subsequent processing operations and is designed to be used in immersion or spray applications.
Solar Strip CT90 is easily waste treated and contains no hazardous fluorides, fluoborates, or peroxides. It can be operated at room temperature for ease of use and reduction of corrosive vapors.
Solar Strip is an acidic, ferric nitrate based stripper that will remove tin and other metallic coatings from solar wafers. It can be used to ensure a clean surface for subsequent processing operations and is designed to be used in immersion or spray applications.
Solar Strip is easily waste treated and contains no hazardous fluorides, fluoborates, or peroxides. It can be operated at room temperature for ease of use and reduction of corrosive vapors.
Solar Strip RS27 is a concentrated aqueous solution formulated to strip aqueous and semi-aqueous dry film resists, liquid photoimageable resists and alkaline soluble, screen printed resists. The Solar Strip RS27 can be used in spray or immersion. Solar Strip RS27 offers extremely fast stripping times and long life.
Due to the relatively low pH of the working solution, the Solar Strip RS27 will not attack tin or tin/lead etch resists or etch the silicon based substrate. Solar Strip RS27 efficiently strips resist while leaving the copper surface clean and free of oxidation.