Making Holes Conductive - Formerly Electrochemicals

Making Holes Conductive

Direct Metallization


Shadow® Direct Metallization Process is a patented graphite based slightly alkaline aqueous dispersion of conductive colloids and proprietary additives used to make through-holes, and other vias, conductive for subsequent copper electroplating. Most suitable for HDI and Flex

Shadow V

For next generation HDI and Flex. For via size less than 50mL

Electroless Copper

Electroless Copper 4000 Process

Electroless Copper 4000 is designed to give unsurpassed interconnect reliability for multilayer applications, as well as superior coverage on all PTH applications. It has been formulated to give a bright, smooth uniform copper deposit of 60 microinches in 30 minutes. The process is based on a patent pending organic stabilizer and does not contain cyanide.  EC 4000 can be run in vertical rack, basket or horizontal lines. A High Reliability Medium-Dep Electroless Cu Process

Electroless Copper Via Dep 4550 Process

Via Dep 4550 Electroless Copper Process is a zero stress electroless copper deposit that is idea for Flexible, Rigidflex and Polyimide circuits.  This low temperature medium build electroless copper system is a non-cyanide tartrate system designed to deposit 40 microinches (1.0 microns) in 20-30 minutes.  Via Dep 4550 can be run in vertical or horizontal lines.

2077 Electroless Copper Series

Sold in China - Easy to run Low Dep Electroless Copper

270 Electroless Copper

A high reliability Med Low-Dep Electroless Cu process

E-Prep Desmear

The E-Prep Series Permanganate Process is a concentrated sodium permanganate system designed to etchback or desmear printed circuit hole walls, and promote increased topography for superior adhesion of the subsequent electroless copper or direct metallization. Permanganate Desmear System for Vertical or Horizontal Lines

Acid Coppers

PC 600 Pulse Copper

Periodic Reverse Pulse Plating additives for high aspect plating with improved throwing power

PC-630 High Throw DC Copper

High Throwing Power Copper process for AR 10:1 or less.  Wide current density range from 15 60 ASF depending on cell agitation

PC-671 / 672 DC Copper for Smooth Finish

Copper additives suppresses micro-nodules for a smooth Cu finish beneficial for critical final finishes, Leveling in the thru hole is excellent

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