StanTek tin and tin alloy processes are designed for a wide variety of electronic applications. In both rack and barrel and high-speed environments, our processes deliver against our customers’ most critical performance criteria. Durability in Pb-free environments, exceptional plating range, ease of use, and consistent solderability are reliably delivered by our processes. Beyond tin and tin/lead plating chemistries, MacDermid offers a full line of pre and post-treatment products. Long recognized as a leader in processes for the treatment, surface preparation, and finishing of metals, our cleaners and activators will assure a quality finish for your electronic components.
Reel to Reel Applications:
The StanTek product line provides a full line of matte and bright processes. Tin or tin/lead, these chemistries are formulated to deliver outstanding current density range, process simplicity, uniform appearance, and exceptional solderability. As expected from MacDermid, a team of responsive and knowledgeable technical service personnel supports these StanTek processes.
StanTek ST 3000: a high speed, satin/matte tin plating process for reel to reel applications. It has been designed for continuous connector and strip plating
StanTek SST 3000: StanTek SST 3000 acid tin plating process produces a fine grained, satin, pure tin deposit. It is designed for rack and barrel plating of electronic components which may also require heat aging prior to soldering and assembly
StanTek AMAT-W: Formulated for high speed wire applications, AMAT-W produces smooth, drawable matte finishes at high current densities
StanTek BT 3000: Produces a uniform, bright pure tin coating from and MSA electrolyte. The tin finish is particularly resilient through high temperature thermal and steam cycles.
StanTek SB 3000: MacDermid StanTek SB 3000 Process is a high speed, bright tin sulfate plating process for reel to reel applications. It has been designed for continuous connector and strip plating.
StanTek 90 Plus: Bright 90/10 tin/lead deposits are produced. Unlike many bright systems, this process is capable of operating at elevated temperatures, eliminating chillers and volume build-up.
Passive Component Metallization:
StanTek PC 1000 and Stantek PC 2000 are matte tin processes developed specifically to satisfy the increasingly stringent plating needs of passive component platers. Miniaturization trends demand a plating process that consistently delivers solderability, thickness control, and reduced chip twinning. StanTek PC series delivers on these needs. StanTek PC 1000 is our low-foaming electrolyte that provides uniform thickness distribution; it operates at an elevated pH that won't affect sensitive substrates.
Plating consistently and reproducibly throughout its bath life, it delivers tin or tin/lead alloys only to terminations, minimizing overplate. Grain-size consistency ensures optimal solderability and excellent control throughout the life of the electrolyte. StanTek PC 1000 is applicable for barrel, RFT, and other plating equipment, and is supplied with a full line of pretreatment chemistries. For exceptional process control and service that make a difference, count on the company that says “Yes We Can.” MacDermid.
Stantek PC 1000 is an electroplating process designed to deposit pure tin for both barrel and rotary-flow-thru (RFT) applications. It may also be used with lead where tin/lead alloys are specified. Stantek PC 1000 is a weak acidic to near neutral plating process specifically designed for plating terminals of passive components. The process has improved throwing power that insures excellent tin distribution. The chemistry minimizes solution attack on pH sensitive ceramic/glass dielectric materials. Stantek PC 1000 is a RoHS/WEEE complaint pure tin.
Stantek PC 2000 is an electroplating process designed to deposit pure tin for both barrel and rotary-flow-thru (RFT) applications. It may also be used with lead where tin/lead alloys are specified. Stantek PC 2000 is an Acid tin Plating process specifically designed for plating terminals of passive components. The process has improved throwing power that insures excellent tin distribution. Stantek PC 2000 is a RoHS/WEEE complaint pure tin.
Plating beyond the termination is minimized with StanTek PC 1000 and PC 2000
Left is the SanTek PC 1000, right is Competitive Chemistry
StanTek PC 1000 was formulated to produce a large and uniform grain structure. This grain is consistently delivered across a wide current density range and throughout the life of the electolyte, assuring excellent solderability of surface mount components.
Left is StanTek PC 1000, right is Competitive Chemistry
StanTek PC 2000
Rack and Barrel Plating
Our sulfate based, bright acid tin process for rack and barrel applications. This chemistry can be operated at elevated temperatures with no chilling required. Excellent throwing power and solderability is maintained throughout its bath life.
StanTek BMAT: A versatile plating system capable of plating tin and tin/lead in both high speed and rack/barrel applications.
StanTek ST 3000 LF: A pure Tin, sulfate based acid process. This process exhibits high throwing power and simple process control.