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Circuit Formation

MacDermid's Circuit Formation Products Group focuses on the chemical technologies of imaging and defining circuit patterns - from the highest density, 2 mil L/S technologies to the systems integrations requirements of transporting ‹2 mil core thicknesses. 

Over the years MacDermid has introduced numerous innovations to these areas, and today we continue to develop processes that can help you obtain the ever-increasing densities necessary for BGA and HDI systems... as well as the bonding requirements for a whole new range of laminate systems.

IN THE NEWS

06.06.2014 -DYCONEX qualifies new Multibond process for high-reliability PCBs; installed new pre-treatment tunnel machine.

 

 

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Innerlayer Processing Systems
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